Articles, field notes, technical guides.
Engineering notes on electronics design: protocols, certifications, embedded cybersecurity, architectural choices, and lessons from industrial projects. 64 articles in English. Full archive in French at /blog/.
- 17 min
High-Performance Electronics Project: A Decision-Maker's Guide
High-performance electronics project guide for decision makers: failure modes, simulation before fabrication, 7 partner questions. AESTECHNO Montpellier.
- 18 min
CUDA vs OpenCL: choosing embedded acceleration in 2026
CUDA vs OpenCL for a new embedded AI project in 2026? AESTECHNO's decision matrix and Jetson Orin NX field report on NVIDIA lock-in, portability and SYCL.
- 15 min
What Is Software-Defined Radio (SDR), and Why Does It Matter?
Software-defined radio (SDR) moves radio processing from hardware into software. Principle, uses and architecture, explained by the AESTECHNO design house.
- 24 min
IoT geolocation: why the LoRaWAN 1% duty cycle changes everything
IoT geolocation compared: GNSS, BLE, UWB, NB-IoT and LoRaWAN. The ETSI 1% duty cycle ceiling kills LoRaWAN before accuracy does. AESTECHNO Montpellier, France.
- 23 min
SoC vs SoM vs SBC vs custom: how to choose right in 2026
SoC vs SoM vs SBC vs custom hardware in 2026: decision matrix and AESTECHNO field report on i.MX 8M Plus at 1k-10k units/year. IP, second-source, BoM.
- 25 min
Why no one builds new CRT TVs in 2026: a design house investigation
AESTECHNO Montpellier investigation on the CRT TV's industrial death: shuttered fabs, infeasible EMC, banned lead glass, prohibitive shipping economics.
- 20 min
CAN, CAN-FD and CAN-XL bus: industrial integration guide
CAN, CAN-FD and CAN-XL bus for industrial systems: architecture, rates to 20 Mbit/s, transceivers, STM32 integration, J1939, UDS. AESTECHNO Montpellier.
- 22 min
PPE resin shortage: high-performance PCB impact
PPE resin shortage after the April 2026 Jubail strike: high-performance PCB laminate impact, Megtron / Rogers / Isola alternates, AESTECHNO BOM strategy.
- 21 min
Power banks in checked bags: the engineering behind the ban
Power banks banned in checked aircraft bags: Li-ion runaway, IATA DGR, 100 Wh, UN 38.3. Contact AESTECHNO Montpellier for battery-transport compliance.
- 20 min
RISC-V in 2026: 25% Market Share Against x86 and ARM
RISC-V hit 25% market share in 2026 against x86 and ARM: RVA23, Tenstorrent, automotive ASIL-D. Get a free audit from our Montpellier electronics design house.
- 23 min
CVE-2026-31431 Copy Fail: kernel LPE, Docker escape, Ansible fix
CVE-2026-31431 'Copy Fail': Linux kernel LPE in algif_aead + Docker container escape. Cmdline mitigation + AESTECHNO open-source Ansible playbook for fleets.
- 24 min
I3C: MIPI's I²C successor for high-rate embedded sensors
I3C replaces I²C on high-rate embedded sensors: 12.5 Mbit/s SDR, HDR-DDR, hot-join, IBI, ENTDAA. Migration guide by AESTECHNO, Montpellier. Free audit.
- 22 min
Stepper motors: drivers, microstepping and motion-control basics
Stepper motor design: NEMA standards, microstepping (1/16, 1/32), driver selection (TMC2209, TMC5160), torque curves, S-curve profiles. AESTECHNO Montpellier.
- 25 min
Accelerate time-to-market for connected products: proven methods
Cut your IoT product time to market without sacrificing quality. Proven methods from AESTECHNO Montpellier: parallelisation, pre-cert modules, EMC pre-scan.
- 24 min
Industrial video: HDMI, SDI, CoaXPress, GigE Vision
HDMI, SDI, CoaXPress CXP-12, GigE Vision and MIPI CSI-2 compared for industrial video. Bandwidth, distance, latency, BOM. AESTECHNO Montpellier guide.
- 26 min
High-speed PCB design: signal integrity, stack-up, certifications
High-speed PCB design guide: DDR5, PCIe Gen 5, USB 3.2, HDMI 2.1 stack-up, controlled impedance, SI/PI simulation. AESTECHNO bureau d'etudes Montpellier.
- 22 min
Cyber Resilience Act 2026: IoT and Embedded Compliance Guide
EU Cyber Resilience Act (CRA): obligations, September 2026 timeline, SBOM, security by design, 24h reporting. AESTECHNO field guide for IoT manufacturers.
- 23 min
Git for electronics engineers: firmware versioning and PCB design
Git for electronics engineers: firmware version control, PCB versioning, branching for embedded teams. AESTECHNO Montpellier guide for CRA-ready repos.
- 26 min
Hardware technical due diligence: an investor's field guide
Hardware technical due diligence: 5-pillar framework, TRL 1-9, CE/RED/CRA red flags, BOM and obsolescence risks. Investor audit by AESTECHNO Montpellier.
- 23 min
How a PCB works: an illustrated guide for engineers
How a PCB works explained step by step: FR4 substrate, copper layers, fabrication and assembly. Illustrated guide by AESTECHNO design house, Montpellier.
- 30 min
USB-C Power Delivery for industrial products: design guide
USB-C Power Delivery for industrial products: PD 3.1 EPR up to 240 W, controllers (TPS25750, FUSB302) and CC line. AESTECHNO design guide, Montpellier France.
- 24 min
Embedded DevOps: CI/CD, automated tests and firmware deployment
Embedded DevOps: firmware CI/CD pipelines, automated tests, static analysis, hardware-in-the-loop and OTA deployment. Practical guide by AESTECHNO Montpellier.
- 23 min
Embedded power management: make a battery last 3 years
Optimise IoT battery life: energy budget, sleep modes, DCDC vs LDO, battery chemistry. Practical guide by AESTECHNO Montpellier, electronic design house.
- 21 min
RISC-V in production: opportunities and risks
RISC-V in industrial production: available silicon, software ecosystem, ARM comparison. Guide for decision-makers and engineers by AESTECHNO Montpellier.
- 24 min
Secure IoT product design: from hardware to field deployment
End-to-end IoT security: secure boot, KMU, signed firmware, TLS 1.3, secure OTA and Cyber Resilience Act. Practical guide from AESTECHNO Montpellier, France.
- 28 min
Electronic product testing and validation: EVT to PVT
Electronic product testing and validation: EVT, DVT, PVT, EMC and CE/FCC certification. Methodology guide from AESTECHNO design house in Montpellier, France.
- 26 min
NB-IoT, LTE-M, satellite: which IoT connectivity to choose?
Long-range IoT connectivity comparison: cellular NB-IoT / LTE-M vs satellite (Kinéis, Astrocast, Iridium). Hardware integration guide by AESTECHNO Montpellier.
- 22 min
Electronics outsourcing: China vs Europe, the real comparison
Electronics outsourcing China vs Europe in 2026: cost, IP, CE/RED, CRA and volumes compared honestly. Free 30-min audit with AESTECHNO Montpellier, France.
- 27 min
Rescue a failed electronics project: diagnostic and recovery plan
Rescue a failed electronics project: audit method, root-cause diagnostic and recovery plan. AESTECHNO Montpellier salvages stalled hardware projects fast.
- 24 min
Electronic product development cost: 7 budget drivers
Electronic product development cost factors: phases, hidden line items, multipliers, levers to keep the budget under control. AESTECHNO Montpellier guide.
- 23 min
RTOS or real-time Linux? Zephyr, FreeRTOS and PREEMPT_RT compared
Zephyr, FreeRTOS or Linux PREEMPT_RT? Compare latency, BLE stack and certification. Free 30-min audit with AESTECHNO Montpellier for embedded projects.
- 22 min
Embedded Linux distributions: 5 criteria to pick the right one
Embedded Linux distros for industrial IoT: Yocto, Buildroot, Alpine, Ubuntu Core, Debian. Selection criteria, BSP, OTA, security. AESTECHNO Montpellier.
- 24 min
Electronic project risk management: anticipate to deliver on time
Master technical, supply chain and regulatory risks in your electronic projects. AESTECHNO Montpellier methodology for product owners and project leads.
- 20 min
Electronic product specification: write a brief that ships
Writing an electronic product specification: requirements, constraints, certifications, BOM, milestones. AESTECHNO Montpellier guide for product owners.
- 22 min
Design for Manufacturing (DFM) for electronics
DFM for electronic products: panel layout, IPC fabrication classes, BOM consolidation, test points, AESTECHNO methodology to cut PCB and assembly cost.
- 23 min
Prototype to series: 5 steps to industrialize an electronic product
5 steps to industrialize an electronic product: POC, EVT/DVT/PVT, CE/FCC, mass production. AESTECHNO Montpellier methodology with IPC Class 3 milestones.
- 21 min
CE/RED certification for IoT products: timelines, costs and pitfalls
CE marking and RED directive for connected objects: process, timelines, costs and common mistakes. Complete guide by AESTECHNO, design house in Montpellier.
- 24 min
Outsource electronic design: 7 criteria for picking a design house
Outsource electronic design: 7 criteria, red flags, pricing models and a 15-question checklist. AESTECHNO Montpellier guide for product owners and CTOs.
- 21 min
UART bus: serial protocol for embedded systems
UART bus in embedded systems: frame format, baud rate, RS-232, RS-485, Modbus and debug consoles. AESTECHNO Montpellier, 10+ years of embedded expertise.
- 23 min
Predictive maintenance IoT: calculating real ROI before you invest
Calculate IoT predictive maintenance ROI: downtime costs, vibration sensors, edge architecture. Decision framework and free audit by AESTECHNO Montpellier.
- 20 min
LPWAN networks compared: LoRaWAN, NB-IoT, Sigfox for IoT
LPWAN comparison 2026: LoRaWAN vs NB-IoT vs Sigfox. Range, power and 5-year TCO for industrial IoT fleet deployment with AESTECHNO design house, Montpellier.
- 29 min
Bluetooth 5.4 PAwR : scalable low-power IoT radio architecture
Bluetooth 5.4 and PAwR for industrial IoT: BLE architecture, Secure Connections security, low-power design. RF hardware certified by AESTECHNO Montpellier.
- 22 min
Electronic design house in Montpellier: AESTECHNO methodology
Electronic design house in Montpellier, France: PCB, firmware, EMC, certification, industrialization. AESTECHNO 6-step EVT/DVT/PVT methodology, 30-min audit.
- 24 min
Industrial IoT cybersecurity: threats and low-cost defenses
Industrial IoT cybersecurity field guide: threats, Zero Trust, signed OTA, secure element and CRA compliance. AESTECHNO design house in Montpellier, France.
- 22 min
Electronic component shortages in 2026: BoM, AVL, second-source
Electronic component shortages in 2026: critical parts, BoM resilience, AVL second-source qualification, supplier diversification. AESTECHNO Montpellier.
- 20 min
IoT database comparison: SQLite, InfluxDB, TimescaleDB, MongoDB
IoT database comparison: SQLite, InfluxDB, TimescaleDB, MongoDB, PostgreSQL. AESTECHNO Montpellier methodology, 30-min audit to size your sensor data.
- 22 min
Biometric sensors for medical IoT: design and certification
Biometric sensors for medical IoT: PPG MAX30101, ECG AD8232, fingerprint 508 DPI, IEC 60601/62304/ISO 13485. AESTECHNO design house, Montpellier. Free audit.
- 23 min
Embedded industrial AI: edge deployment on Jetson Orin
Embedded industrial AI on the edge: Jetson Orin NX, INT8 quantization, TensorRT, ONNX. Methodology and case studies. AESTECHNO Montpellier 30-min audit.
- 21 min
DDR4 vs DDR5: technical differences, throughput, JEDEC
DDR4 vs DDR5 compared: bandwidth, voltage, dual-channel architecture, JEDEC standards and PCB routing rules. Engineering guide by AESTECHNO Montpellier, France.
- 19 min
Electronic product design: EVT, DVT, PVT and certification phases
Electronic product design from idea to CE/FCC certified series: EVT, DVT, PVT phases, EMC and DFM. AESTECHNO Montpellier methodology, free 30-min audit.
- 22 min
RF PCB design: layout rules, impedance control, certification
RF PCB design: the errors that kill radio range, controlled-impedance routing and RED certification for BLE, LoRa and Wi-Fi. AESTECHNO Montpellier expertise.
- 22 min
IoT electronics design: from concept to certified product
IoT electronics design methodology: low-power architecture, radio choice, RED/CE certification and OTA security. AESTECHNO Montpellier engineering guide.
- 22 min
FPGA board design: from architecture to industrialisation
Custom FPGA board design with Xilinx (AMD), Intel and Lattice: real-time processing, edge AI and industrial vision. AESTECHNO Montpellier design house.
- 18 min
NVIDIA Jetson Orin: embedded AI from board to product
NVIDIA Jetson guide for embedded AI: Orin Nano, Orin NX, AGX Orin. GPU architecture, robotics and vision, custom carrier board by AESTECHNO Montpellier.
- 26 min
LVDS and OpenLDI: high-speed video for industrial displays
Guide to Open LVDS / OpenLDI: LCD / OLED display interface, differential signalling, FPD-Link protocol, EDID. Embedded display design, AESTECHNO Montpellier.
- 27 min
EMC: electromagnetic compatibility for industrial electronics
EMC by design: anticipate electromagnetic compatibility from the schematic, pass CE/FCC tests first time. Pre-compliance, standards, AESTECHNO Montpellier.
- 24 min
MEMS accelerometer design guide: selection, integration, calibration
MEMS accelerometer design: ranges, ODR, noise, axis alignment, ADXL355, LSM6DSO32X, IMU integration. AESTECHNO industrial design house in Montpellier.
- 17 min
SPI bus in 2026: full-duplex, modes 0-3, MISO/MOSI/CS, speeds
SPI bus in 2026: full-duplex master/slave protocol, modes 0-3, MISO/MOSI/CS lines, speeds up to 50 MHz, IoT, NOR Flash, sensors. AESTECHNO Montpellier.
- 29 min
PCB design guide: stack-up, impedance and EMC compliance
PCB design fundamentals: stack-up, controlled impedance (50/90/100 Ω), differential pairs, EMC compliance, IPC 2221/6012. AESTECHNO Montpellier design house.
- 25 min
LPDDR4 memory design: routing, signal integrity, power
Complete LPDDR4 design guide: high-speed routing, skew control, controlled impedance, S11 parameter, DQ/DQS groups, PCB stack-up. AESTECHNO Montpellier.
- 22 min
Industrial embedded software: RTOS, Linux, firmware certification
Industrial embedded software guide: bare-metal vs RTOS vs Linux, FreeRTOS, Zephyr, Yocto, IEC 62304, secure boot and signed OTA. AESTECHNO Montpellier, France.
- 23 min
USB 3.2 vs USB4 in 2026: 20-40 Gbps, Type-C, design choice
USB 3.2 and USB4 in 2026: 5-40 Gbps speeds, Type-A/C connectors, USB 2.0 backward compatibility, external NVMe storage, 8K video. AESTECHNO Montpellier.
- 19 min
I2C bus in 2026: protocol, 7/10-bit addressing, pull-ups, speeds
I2C bus in 2026: master/slave protocol, 7/10-bit addressing, 100 kHz to 5 MHz (Fast/Fast+/HS), pull-ups and IoT designs. AESTECHNO Montpellier design house.
- 24 min
PCIe 4.0, 5.0, 6.0 in 2026: speeds, lanes, NVMe, FPGA, AI
PCIe 4.0, 5.0 and 6.0 in 2026: 64 GT/s rates, x1-x16 lane architecture, NVMe, FPGA and AI accelerator uses. AESTECHNO design office in Montpellier, France.